Chip-Surface Based Visual Authentication for Integrated Circuits
Runze Liu, Prasun Datta, Anirudh Nakra, Chau-Wai Wong, Min Wu

TL;DR
This paper introduces an optical PUF-based method for IC chip authentication using consumer-grade imaging devices, achieving high accuracy and enhancing security in the semiconductor supply chain.
Contribution
It is the first to apply optical PUFs for IC authentication, utilizing simple imaging techniques and a lightweight verification scheme for improved security.
Findings
Achieved an EER of 0.0008 with the proposed scheme.
Consumer-grade devices can capture meaningful IC surface features.
Extensive studies validated the robustness of the verification method.
Abstract
The rapid development of the semiconductor industry and the ubiquity of electronic devices have led to a significant increase in the counterfeiting of integrated circuits (ICs). This poses a major threat to public health, the banking industry, and military defense sectors that are heavily reliant on electronic systems. The electronic physically unclonable functions (PUFs) are widely used to authenticate IC chips at the unit level. However, electronic PUFs are limited by their requirement for IC chips to be in working status for measurements and their sensitivity to environmental variations. This paper proposes using optical PUFs for IC chip authentication by leveraging the unique microscopic structures of the packaging surface of individual IC chips. The proposed method relies on color images of IC chip surfaces acquired using a flatbed scanner or mobile camera. Our initial study…
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Taxonomy
TopicsPhysical Unclonable Functions (PUFs) and Hardware Security · VLSI and Analog Circuit Testing · 3D IC and TSV technologies
