Electrically Interconnected Platinum Nanonetworks for Flexible Electronics
Sherjeel Mahmood Baig, Hideki Abe

TL;DR
This paper presents a novel platinum nanonetwork fabrication method on flexible substrates, demonstrating superior electrical stability and mechanical flexibility compared to traditional ITO in flexible electronics.
Contribution
Introduces a new atmospheric treatment process to create interconnected platinum nanonetworks on polyimide, enhancing durability and electrical performance in flexible electronic devices.
Findings
Pt nanonetworks maintain low resistance after 1000 bending cycles
Interconnected nanonetworks exhibit inductor-like electrical responses
Optimal atmospheric treatment conditions are identified for nanonetwork formation
Abstract
Flexible electronics are attracting attention due to the increasing demand for lightweight, bendable devices that can conform to various surfaces, including human skin. Although indium tin oxide (ITO) is widely used for electrical interconnection in flexible electronics, its brittleness limits its durability under repeated bending. In this study, we introduce platinum (Pt) nanonetworks as an alternative to ITO, offering superior electrical stability under intense and repeated bending conditions. Electrically interconnected Pt nanonetworks, with an average thickness below 50 nm, are fabricated on polyimide (PI) substrates through an atmospheric treatment that promotes nanophase separation in thin deposition films of a platinum-cerium (Pt-Ce) alloy, creating a nanotexture of Pt and insulating cerium dioxide (CeO2). The resulting Pt nanonetworks on PI exhibit high mechanical flexibility,…
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Taxonomy
TopicsGold and Silver Nanoparticles Synthesis and Applications · Anodic Oxide Films and Nanostructures · Molecular Junctions and Nanostructures
