Parametric study of filament and gap models of resistive switching in TaO$_x$-based devices
Rongchen Li, Yang Bai, Marek Skowronski

TL;DR
This study uses finite element modeling to investigate the parameters influencing resistive switching in TaO$_x$ devices, aligning simulations with experimental data and revealing insights into filament composition and behavior.
Contribution
The paper introduces a comprehensive finite element model that accurately reproduces experimental I-V characteristics and filament properties in TaO$_x$ resistive switching devices.
Findings
Filament diameter between 6 and 22 nm matches experimental conductance.
Filament oxygen content below TaO$_{1.3}$ aligns with experimental data.
Non-linear I-V behavior explained without assuming Poole-Frenkel conduction.
Abstract
A finite element model consisting of a conducting filament with or without a gap was used to reproduce behavior of TaO-based resistive switching devices. The specific goal was to explore the range of possible filament parameters such a filament diameter, composition, gap width, and composition to reproduce the conductance and shape of I-V while keeping the maximum temperature within acceptable range allowing for ion motion and preventing melting. The model solving heat and charge transport produced a good agreement with experimental data for the oxygen content in the filament below TaO, the filament diameter range between 6 and 22 nm, and the gap oxygen content between TaO and TaO. Gap width was not limited on either low or high sides by the criteria considered in this report. The obtained filament composition corresponds to oxygen deficiency an order of…
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Taxonomy
TopicsAdvanced Memory and Neural Computing · Transition Metal Oxide Nanomaterials · CCD and CMOS Imaging Sensors
