Viscoelastic peeling of thin tapes with frictional sliding

TL;DR

This paper develops a theoretical model for peeling thin viscoelastic tapes from rigid substrates, highlighting how frictional sliding and viscoelasticity influence delamination resistance and toughness.

Contribution

It introduces a comprehensive framework incorporating viscoelasticity and frictional dissipation into peeling behavior analysis, which was lacking in prior studies.

Findings

Frictional sliding can enhance adhesive toughness.

Delamination resistance depends strongly on peeling velocity.

Viscoelastic effects significantly alter peeling dynamics.

Abstract

Peeling is one of the most common detachment mechanisms adopted in industrial applications. However, although several experimental investigations have proven the possible occurrence of relative sliding at the interface close to the peeling front, a comprehensive model considering the effect of both the tape viscoelasticity and frictional interfacial dissipation on the peeling behavior is lacking. The present study aims at providing a theoretical framework to investigate the peeling process of a thin viscoelastic tape from a rigid substrate in the presence of frictional sliding at the interface. It shows that, under certain conditions, significantly tougher adhesive performance can be achieved compared to stuck elastic conditions with no interfacial sliding, and that the delamination resistance of the system strongly depends on the propagation velocity.