Optimizing Cladding Elasticity to Enhance Sensitivity in Silicon Photonic Ultrasound Sensors
R. Tufan Erdogan, Georgy A. Filonenko, Stephen J. Picken, Peter G., Steeneken, Wouter J. Westerveld

TL;DR
This paper demonstrates that optimizing the mechanical stiffness of polymer cladding on silicon photonic ultrasound sensors significantly increases their sensitivity, enabling better photo-acoustic imaging for medical diagnostics.
Contribution
It introduces a novel approach to enhance silicon photonic sensor sensitivity by tuning the polymer cladding's stiffness, supported by modeling and experimental validation.
Findings
Fourfold increase in sensitivity with optimized polymer cladding
Sensitivity doubled with specific polymer cross-linking density
Young's Modulus change alone does not fully explain sensitivity improvements
Abstract
Ultrasound is widely used in medical imaging, and emerging photo-acoustic imaging is crucial for disease diagnosis. Currently, high-end photo-acoustic imaging systems rely on piezo-electric materials for detecting ultrasound waves, which come with sensitivity, noise, and bandwidth limitations. Advanced applications demand a large matrix of broadband, high-resolution, and scalable ultrasound sensors. Silicon photonic circuits have been introduced to meet these requirements by detecting ultrasound-induced deformation and stress in silicon waveguides. Although higher sensitivities could facilitate the exploration of new applications, the high stiffness of the waveguide materials constrains the intrinsic sensitivity of the silicon photonic circuits to ultrasound signals. Here, we explore the impact of the mechanical properties of a polymer cladding on the sensitivity of silicon photonic…
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