Aluminum Scandium Nitride as a Functional Material at 1000{\deg}C

TL;DR

This study demonstrates that aluminum scandium nitride (AlScN) maintains and even enhances its ferroelectric, piezoelectric, and dielectric properties at temperatures up to 1000°C, making it suitable for extreme high-temperature applications.

Contribution

It provides comprehensive experimental evidence of AlScN's thermal stability and functional enhancement at 1000°C, a significant advancement over previous high-temperature ferroelectric materials.

Findings

AlScN retains ferroelectric and dielectric properties up to 1000°C.

Piezoelectric coefficient increases nearly tenfold at high temperatures.

Electromechanical coupling coefficient increases over 500% at elevated temperatures.

Abstract

Aluminum scandium nitride (AlScN) has emerged as a highly promising material for high-temperature applications due to its robust piezoelectric, ferroelectric, and dielectric properties. This study investigates the behavior of Al0.7Sc0.3N thin films in extreme thermal environments, demonstrating functional stability up to 1000{\deg}C, making it suitable for use in aerospace, hypersonics, deep-well, and nuclear reactor systems. Tantalum silicide (TaSi2)/Al0.7Sc0.3N/TaSi2 capacitors were fabricated and characterized across a wide temperature range, revealing robust ferroelectric and dielectric properties, along with significant enhancement in piezoelectric performance. At 1000{\deg}C, the ferroelectric hysteresis loops showed a substantial reduction in coercive field from 4.3 MV/cm to 1.2 MV/cm, while the longitudinal piezoelectric coefficient increased nearly tenfold, reaching 75.1 pm/V at 800{\deg}C. Structural analysis via scanning and transmission electron microscopy confirmed the integrity of the TaSi2/Al0.7Sc0.3N interfaces, even after exposure to extreme temperatures. Furthermore, the electromechanical coupling coefficient was calculated to increase by over 500%, from 12.9% at room temperature to 82% at 700{\deg}C. These findings establish AlScN as a versatile material for high-temperature ferroelectric, piezoelectric, and dielectric applications, offering unprecedented thermal stability and functional enhancement.