12-spin-qubit arrays fabricated on a 300 mm semiconductor manufacturing line

TL;DR

This paper reports on the design, fabrication, and testing of a 12-spin-qubit array on a 300 mm semiconductor line, demonstrating scalable quantum device manufacturing using high-volume industrial processes.

Contribution

It introduces a new quantum test chip with 12 spin qubits fabricated via standard high-volume semiconductor processes, advancing scalable quantum computing hardware.

Findings

Successful fabrication of 12-qubit arrays using EUV lithography

Device characterization confirms qubit functionality

Supports scaling of 2D qubit array schemes

Abstract

Intels efforts to build a practical quantum computer are focused on developing a scalable spin-qubit platform leveraging industrial high-volume semiconductor manufacturing expertise and 300 mm fabrication infrastructure. Here, we provide an overview of the design, fabrication, and demonstration of a new customized quantum test chip, which contains 12-quantum-dot spin-qubit linear arrays, code named Tunnel Falls. These devices are fabricated using immersion and extreme ultraviolet lithography (EUV), along with other standard high-volume manufacturing (HVM) processes, as well as production-level process control. We present key device features and fabrication details, as well as qubit characterization results confirming device functionality. These results corroborate our fabrication methods and are a crucial step towards scaling of extensible 2D qubit array schemes.