NiOx/\b{eta}-Ga2O3 Heterojunction Diode Achieving Breakdown Voltage >3 kV with Plasma Etch Field-Termination
Yizheng Liu, Saurav Roy, Carl Peterson, Arkka Bhattacharyya, and, Sriram Krishnamoorthy

TL;DR
This paper reports a NiOx/eta-Ga2O3 heterojunction diode with over 3 kV breakdown voltage, low leakage, and high electric fields, achieved through plasma etch field-termination, demonstrating promising high-voltage device performance.
Contribution
The work introduces a novel fabrication of NiOx/eta-Ga2O3 heterojunction diodes with record-high breakdown voltage and improved field-termination techniques, advancing high-voltage semiconductor device technology.
Findings
Breakdown voltage >3 kV on 100-μm pads
Low reverse leakage current density (~10^-8 to 10^-6 A/cm^2)
High junction electric field (>3.34 MV/cm) at 3 kV
Abstract
This work reports the fabrication and characterization of a NiOx/\b{eta}-Ga2O3 heterojunction diode (HJD) that uses a metallic nickel (Ni) target to deposit NiOx layers via reactive RF magnetron sputtering and lift-off processing with >3 kV breakdown voltage, record-low reverse current leakage under high reverse bias, and high junction electric fields (>3.34 MV/cm). The heterojunction diodes are fabricated via bilayer NiOx sputtering followed by self-aligned mesa-etching for field-termination on both large (1-mm2) and small area (100-{\mu}m diameter) devices. The HJD exhibits a ~135 A/cm2 forward current density at 5 V with a rectifying ratio of ~1010. The minimum differential specific on-resistance is measured to be 17.26 m{\Omega} cm2. The breakdown voltage on 100-{\mu}m diameter pads was measured to be greater than 3 kV with a noise floor-level reverse leakage current density…
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Taxonomy
TopicsGa2O3 and related materials · Advanced Photocatalysis Techniques · Semiconductor materials and devices
