Optimization of a Microsphere-based Variable Density Multilayer Insulation System for Cryogenic Applications

TL;DR

This study models and optimizes a microsphere-based multilayer insulation system for cryogenic vessels, considering microstructural effects and convection, to identify optimal layer thicknesses and configurations for various pressures.

Contribution

It introduces a unit cell-based analytical model that accounts for microstructural effects and convection, optimizing multilayer insulation performance for cryogenic applications.

Findings

Optimal HGM layer thickness: 120-130mm.

Best VDMLI configuration: repeating spacer layers.

Performance varies with pressure and boundary temperature.

Abstract

One of the standard composite insulation systems for cryogenic applications consists of a layer of hollow glass microspheres (HGMs) followed by a layer of variable density multilayer insulation (VDMLI) comprised of various internal combinations of reflectors and spacers. Microstructural effects of the HGM assembly and convection between the vessel and its surroundings are unaccounted for in existing calculations, which the current study incorporates in the unit cell-based HGM analytical model. Building on it, the insulation performance of the HGM layer with increasing thickness is studied for a Dewar insulation system containing liquid nitrogen (boiling point 78 K) based on pressures ranging from high vacuum (0.0133 Pa) to atmospheric (105 Pa) for two benchmark cryogenic vessel sizes. A suitable range of thickness for both systems is suggested. Further, the performance of four arithmetic progression-based VDMLI profiles in combination with an optimal HGM layer is studied. A VDMLI configuration with repeating spacer layers is found to perform best in high-pressure conditions. Finally, based on heat transfer performance within the given range of pressures and warm boundary temperatures up to 393 K, optimal thickness values of 120-130mm for the HGM layer and 125mm for the best VDMLI configuration are reported.