High fidelity TiN processing modes for multi-gate Ge-based quantum devices
Sinan Bugu, Sheshank Biradar, Alan Blake, CheWee Liu, Maksym Myronovd,, Ray Duffy, Giorgos Fagas, Nikolay Petkov

TL;DR
This paper presents a high-resolution TiN multi-gate fabrication process using hydrogen silsesquioxane resist for quantum dot devices, enabling precise, high-fidelity patterning essential for scalable quantum computing architectures.
Contribution
It introduces a novel TiN gate definition method with hydrogen silsesquioxane resist, achieving 15 nm resolution and demonstrating applicability to multi-gate Ge-based quantum devices.
Findings
Achieved gate dimensions down to 15 nm with high fidelity.
Demonstrated multi-gate architectures for Ge-based quantum devices.
Validated the process for complex, high-density gate arrays.
Abstract
Charge or spin-qubits can be realized by using gate-defined quantum dots (QDs) in semiconductors in a similar fashion to the processes used in CMOS for conventional field-effect transistors or more recent fin FET technology. However, to realize larger number of gate-defined qubits, multiples of gates with ultimately high resolution and fidelity is required. Electron beam lithography (EBL) offers flexible and tunable patterning of gate-defined spin-qubit devices for studying important quantum phenomena. While such devices are commonly realized by a positive resist process using metal lift-off, there are several clear limitations related to the resolution and the fidelity of patterning. Herein, we report a systematic study of an alternative TiN multi-gates definition approach based on the highest resolution hydrogen silsesquioxane (HSQ) EBL resist and all associated processing modes. The…
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Taxonomy
TopicsPhotonic and Optical Devices · Quantum Information and Cryptography · Semiconductor Quantum Structures and Devices
