In Situ Growth of Copper Channels within CuCl and PVDF Composite for Durable WORM Device Formation
Shilpi Bose, Aloka Sinha, Santanu Ghosh

TL;DR
This paper presents a novel in situ growth method for copper channels within a CuCl-PVDF composite to create durable WORM memory devices with stable resistive switching properties.
Contribution
It introduces a new fabrication approach for in-situ copper channel formation in polymer composites for reliable WORM memory applications.
Findings
Stable memory retention demonstrated over extended periods.
In-situ copper channels enable resistive switching behavior.
Potential for use in optical and digital storage devices.
Abstract
This study details the creation of a Write Once-Read Many (WORM) memory device utilizing cuprous chloride (CuCl) and poly(vinylidene fluoride-co-hexafluoropropylene) (PVDF-HFP) polymers. Employing an in-plane configuration, a deliberate 1:10 ratio of CuCl to PVDF-HFP has been selected. This ratio aims to establish an in-situ copper channel within the device. The electrical response exhibits consistent memory retention over an extended duration. The WORM characteristics are attributed to the development of multiple conducting filaments or a highly conductive percolative path created by Cu ions within the polymer matrix. The UV-Vis study also reinforces the obtained results. Additionally, the memristor undergoes specific poling and cooling conditions. The fabrication approach employed in this research yields a distinctive type of Resistive Switching Device (RSD). Once the device is…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsCopper Interconnects and Reliability · Electrodeposition and Electroless Coatings · Advanced Sensor and Energy Harvesting Materials
