Benchmarking Emerging Cavity-Mediated Quantum Interconnect Technologies for Modular Quantum Computers

TL;DR

This paper benchmarks cavity-mediated quantum interconnect technologies for modular quantum computers, analyzing their efficiency and guiding scalable chip-to-chip communication development.

Contribution

It provides a comparative analysis of cavity-mediated interconnects using Design Space Exploration to identify optimal configurations for high-fidelity quantum communication.

Findings

Identifies key cavity and atomic decay rate configurations for efficiency thresholds.

Provides a benchmark framework for cavity-mediated quantum interconnects.

Guides development of scalable chip-to-chip links for quantum computers.

Abstract

Modularity is a promising approach for scaling up quantum computers and therefore integrating higher qubit counts. The essence of such architectures lies in their reliance on high-fidelity and fast quantum state transfers enabled by generating entanglement between chips. In addressing the challenge of implementing quantum coherent communication channels to interconnect quantum processors, various techniques have been proposed to account for qubit technology specifications and the implemented communication protocol. By employing Design Space Exploration (DSE) methodologies, this work presents a comparative analysis of the cavity-mediated interconnect technologies according to a defined figure of merit, and we identify the configurations related to the cavity and atomic decay rates as well as the qubit-cavity coupling strength that meet the efficiency thresholds. We therefore contribute to benchmarking contemporary cavity-mediated quantum interconnects and guide the development of reliable and scalable chip-to-chip links for modular quantum computers.