A Framework for Simulating the Path-level Residual Stress in the Laser Powder Bed Fusion Process

TL;DR

This paper introduces a computationally efficient framework for simulating residual stress in Laser Powder Bed Fusion by focusing on path-level thermal history, enabling better understanding of process-induced stresses with less intensive computation.

Contribution

The paper presents a novel path-level simulation framework using effective thermal strain, reducing computational complexity while accurately capturing residual stresses in LPBF.

Findings

Path-level simulation reduces computational load compared to full-scale models.

Effective thermal strain captures anisotropic effects near melt pools.

Simulation results reveal how scanning patterns influence residual stress.

Abstract

Laser Powder Bed Fusion (LPBF) additive manufacturing has revolutionized industries with its capability to create intricate and customized components. The LPBF process uses moving heat sources to melt and solidify metal powders. The fast melting and cooling leads to residual stress, which critically affects the part quality. Currently, the computational intensity of accurately simulating the residual stress on the path scale remains a significant challenge, limiting our understanding of the LPBF processes. This paper presents a framework for simulating the LPBF process residual stress based on the path-level thermal history. Compared with the existing approaches, the path-level simulation requires discretization only to capture the scanning path rather than the details of the melt pools, thus requiring less dense mesh and is more computationally efficient. We develop this framework by introducing a new concept termed effective thermal strain to capture the anisotropic thermal strain near and around the melt pool. We validate our approach with the high-fidelity results from the literature. We use the proposed approach to simulate various single-island scanning patterns and layers with multiple full and trimmed islands. We further investigate the influence of the path-level thermal history and the layer shape on the residual stress by analyzing their simulation results.