A convolutional model for estimating the junction temperatures of SiC MOSFET transistors

TL;DR

This paper introduces a convolutional thermal model to estimate the junction temperatures of SiC MOSFETs using external temperature measurements and power data, addressing measurement challenges in power electronics.

Contribution

A novel convolutional model that accurately estimates MOSFET junction temperatures from external data, considering thermal coupling and validated through simulations and experiments.

Findings

Model accurately predicts junction temperatures

Robustness demonstrated through simulations and experiments

Addresses measurement challenges in power electronics

Abstract

The junction temperature is a very important parameter for monitoring power electronics converters based on MOSFET transistors. They offer the possibility of switching at relatively higher frequencies than other transistors like IGTBTs. However, the electrical parameters of MOSFETs are highly thermally dependent. The thermo-dependence of MOSFET electrical parameters is rarely taken into consideration when implementing control strategies, for many technological reasons, such as the difficulty of measuring the junction temperature. In practice, the junction temperature of transistors is inaccessible for direct measurement. The presence of a gel covering the chips, that provides electrical and thermal insulation, makes measurement by infrared thermography impossible. Furthermore, direct thermocouple measurement cannot be implemented due to the electromagnetic disturbances in the environment. Several researchers have attempted to correlate chip temperature with thermosensitive electrical parameters. In the present work, a thermal convolutive model has been developed to estimate the junction temperatures of two MOSFET transistors belonging to the same electronic circuit from external temperature measurements in two well-chosen locations (far away enough from the junction to avoid electromagnetic interference), using also the measured power dissipated on each chip. The thermal coupling between the two transistors has been considered in the form of mutual transmittances. The model was first calibrated using three-dimensional numerical simulations in COMSOL Multiphysics, followed by an experimental study. The results are very promising, illustrating the robustness of the convolutional model.