Integration of through-sapphire substrate machining with superconducting quantum processors
Narendra Acharya, Robert Armstrong, Yashwanth Balaji, Kevin G, Crawford, James C Gates, Paul C Gow, Oscar W Kennedy, Renuka Devi Pothuraju,, Kowsar Shahbazi, Connor D Shelly

TL;DR
This paper introduces a sapphire machining process compatible with high-coherence superconducting qubits, enabling through-sapphire vias and improved scalability for quantum processors.
Contribution
The authors develop a sapphire machining technique that allows through-substrate electrical connections, facilitating scalable quantum processor architectures.
Findings
Demonstrated sapphire machining process compatible with high-coherence qubits
Enabled through-sapphire vias for improved signal routing
Facilitated scaling of quantum processing units with sapphire substrates
Abstract
We demonstrate a sapphire machining process integrated with intermediate-scale quantum processors. The process allows through-substrate electrical connections, necessary for low-frequency mode-mitigation, as well as signal-routing, which are vital as quantum computers scale in qubit number, and thus dimension. High-coherence qubits are required to build fault-tolerant quantum computers and so material choices are an important consideration when developing a qubit technology platform. Sapphire, as a low-loss dielectric substrate, has shown to support high-coherence qubits. In addition, recent advances in material choices such as tantalum and titanium-nitride, both deposited on a sapphire substrate, have demonstrated qubit lifetimes exceeding 0.3 ms. However, the lack of any process equivalent of deep-silicon etching to create through-substrate-vias in sapphire, or to inductively shunt…
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Taxonomy
TopicsSemiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design · Advanced Surface Polishing Techniques
