Evaluating Vulnerability of Chiplet-Based Systems to Contactless Probing Techniques
Aleksa Deric, Kyle Mitard, Shahin Tajik, Daniel Holcomb

TL;DR
This paper investigates the security vulnerabilities of chiplet-based systems, demonstrating that contactless laser probing can effectively access interposer wires and that existing delay-based sensors are ineffective against such attacks.
Contribution
It provides the first evaluation of laser contactless probing on chiplet-based FPGA systems, highlighting specific vulnerabilities and limitations of current protective measures.
Findings
Probing interposer wire drivers is easier than internal nodes.
Laser probing causes a delay change of only 0.792ps at full power.
Delay-based sensors are ineffective against laser contactless probing.
Abstract
Driven by a need for ever increasing chip performance and inclusion of innovative features, a growing number of semiconductor companies are opting for all-inclusive System-on-Chip (SoC) architectures. Although Moore's Law has been able to keep up with the demand for more complex logic, manufacturing large dies still poses a challenge. Increasingly the solution adopted to minimize the impact of silicon defects on manufacturing yield has been to split a design into multiple smaller dies called chiplets which are then brought together on a silicon interposer. Advanced 2.5D and 3D packaging techniques that enable this kind of integration also promise increased power efficiency and opportunities for heterogeneous integration. However, despite their advantages, chiplets are not without issues. Apart from manufacturing challenges that come with new packaging techniques, disaggregating a…
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Taxonomy
TopicsIntegrated Circuits and Semiconductor Failure Analysis · Physical Unclonable Functions (PUFs) and Hardware Security · Electrostatic Discharge in Electronics
