Describing heat dissipation in the resistive state of three-dimensional superconductors

TL;DR

This paper investigates how heat diffusion affects the resistive state of three-dimensional superconductors, emphasizing the importance of substrate efficiency, film thickness, and the Ginzburg-Landau parameter in modeling their complex dynamics.

Contribution

It introduces a comprehensive model coupling the 3D Ginzburg-Landau and heat diffusion equations to accurately simulate superconducting film behavior near the transition temperature.

Findings

Heat diffusion significantly influences the resistive transition behavior.

Substrate efficiency impacts the system's dynamics, especially at lower temperatures.

The model captures hysteresis, film thickness, and Ginzburg-Landau effects in superconductors.

Abstract

In this work we study the role of the heat diffusion equation in simulating the resistive state of superconducting films. By analyzing the current-voltage and current-resistance characteristic curves for temperatures close to $T_c$ and various heat removal scenarios, we demonstrate that heat diffusion notably influences the behavior of the resistive state, specially near the transition to the normal state, where heat significantly changes the critical current and the calculated resistance. Furthermore, we show how the efficiency of the substrate has important effects in the dynamics of the system, particularly for lower temperatures. Finally, we investigate the hysteresis loops, the role of the film thickness and of the Ginzburg-Landau parameter, the findings accounting for heat diffusion in accurately modeling the resistive state of superconducting films and provide valuable insights into its complex dynamics. To accomplish these findings, we have used the $3D$ generalized Ginzburg-Landau equation coupled with the heat diffusion equation.