Residual Stress Development in Lattice Mismatched Epitaxial Thin Films via Atomic and Molecular Layer Depositions
Musanna Galib, Okan K. Orhan, Jian Liu, Mauricio Ponga

TL;DR
This paper combines ab initio simulations and continuum models to understand residual stress development in lattice-mismatched ALD/MLD coatings on Zn anodes, revealing how chemo-mechanical stresses influence dendrite suppression.
Contribution
It introduces a multiscale approach integrating simulations and experiments to predict residual stresses in lattice-mismatched thin films on battery anodes.
Findings
Large misfit strains cause significant interfacial stresses during deposition.
Good agreement between experimental curvature measurements and theoretical predictions.
Chemical bonding influences residual stress development in thin film coatings.
Abstract
Atomic and molecular layer deposition (ALD/MLD) coatings are promising solutions for preventing dendrite formation in aqueous and non-aqueous Li/Na/Zn metal batteries. Notably, alumina and alucone coatings have emerged as highly effective against dendrite formation in Zn anodes. Despite their demonstrated efficacy, a comprehensive understanding of their chemo-mechanical impact on anodes remains elusive. In this study, we take a bottom-up framework to these coatings on Zn foils, employing an approach that integrates \textit{ab initio} simulations with continuum theories to elucidate lattice misfit and chemical bonding. We use this insight to develop a macroscopic model to predict the epitaxial residual stresses generated during thin-film deposition. Our findings reveal a robust chemical bonding between the hydroxylated Zn surface and the thin film. This, in turn, generates large misfit…
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Taxonomy
TopicsSemiconductor materials and devices · Metal and Thin Film Mechanics · Copper Interconnects and Reliability
