Significant improvement in sensitivity of an anomalous Nernst heat flux sensor by composite structure

TL;DR

This paper demonstrates a fourfold increase in the sensitivity of an anomalous Nernst heat flux sensor by using composite structures with 3D uneven TbCo films, independent of material properties, enabling highly sensitive heat flux detection.

Contribution

The study introduces a novel composite structure and device geometry optimization that significantly enhances ANE-based heat flux sensor sensitivity, surpassing previous limitations.

Findings

Sensitivity increased by approximately four times.

Composite structures enable sensitivity enhancement independent of material properties.

The approach facilitates development of highly sensitive and 3D heat flux sensors.

Abstract

Heat flux sensors (HFS) have attracted significant interest for their potential in managing waste heat efficiently. A recently proposed HFS, that works on the basis of the anomalous Nernst effect (ANE), offers several advantages in its simple structure leading to easy fabrication, low cost, and reduced thermal resistance. However, enhancing sensitivity through traditional material selection is now challenging due to a small number of materials satisfying the required coexistence of a large transverse Seebeck coefficient and low thermal conductivity. In this study, by utilizing composite structures and optimizing the device geometry, we have achieved a substantial improvement in the sensitivity of an ANE-based HFS. We developed composite structures comprised of a plastic substrate with an uneven surface and three-dimensional (3D) uneven TbCo films, fabricated using nanoimprint techniques and sputtering. This approach resulted in a sensitivity that is approximately four times greater than that observed in previous studies. Importantly, this method is independent of the material properties and can significantly enhance the sensitivity. Our findings could lead to the development of highly sensitive HFS devices and open new avenues for the fabrication of 3D devices.