Simultaneous Many-Row Activation in Off-the-Shelf DRAM Chips: Experimental Characterization and Analysis
Ismail Emir Yuksel, Yahya Can Tugrul, F. Nisa Bostanci, Geraldo F., Oliveira, A. Giray Yaglikci, Ataberk Olgun, Melina Soysal, Haocong Luo, Juan, G\'omez-Luna, Mohammad Sadrosadati, Onur Mutlu

TL;DR
This paper experimentally demonstrates that off-the-shelf DRAM chips can perform multiple advanced operations simultaneously, such as activating many rows and executing majority functions, with high resilience to environmental variations, highlighting DRAM's potential for computation.
Contribution
The study provides the first extensive empirical characterization of many-row activation and in-DRAM computation capabilities in commercial DDR4 chips, revealing new computational possibilities.
Findings
COTS DRAM can activate up to 32 rows simultaneously.
DRAM can perform majority operations like MAJ5, MAJ7, MAJ9.
Multi-RowCopy enables copying a row to up to 31 others.
Abstract
We experimentally analyze the computational capability of commercial off-the-shelf (COTS) DRAM chips and the robustness of these capabilities under various timing delays between DRAM commands, data patterns, temperature, and voltage levels. We extensively characterize 120 COTS DDR4 chips from two major manufacturers. We highlight four key results of our study. First, COTS DRAM chips are capable of 1) simultaneously activating up to 32 rows (i.e., simultaneous many-row activation), 2) executing a majority of X (MAJX) operation where X>3 (i.e., MAJ5, MAJ7, and MAJ9 operations), and 3) copying a DRAM row (concurrently) to up to 31 other DRAM rows, which we call Multi-RowCopy. Second, storing multiple copies of MAJX's input operands on all simultaneously activated rows drastically increases the success rate (i.e., the percentage of DRAM cells that correctly perform the computation) of the…
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Taxonomy
TopicsAdvancements in Semiconductor Devices and Circuit Design · Semiconductor materials and devices · Ferroelectric and Negative Capacitance Devices
