Controlled Fabrication of Native Ultra-Thin Amorphous Gallium Oxide from 2D Gallium Sulfide for Emerging Electronic Applications
AbdulAziz AlMutairi, Aferdita Xhameni, Xuyun Guo, Irina Chirc\u{a},, Valeria Nicolosi, Stephan Hofmann, Antonio Lombardo

TL;DR
This paper demonstrates a controlled oxidation process of 2D gallium sulfide to create ultrathin gallium oxide layers, enabling low-power resistive memory devices with high endurance and retention.
Contribution
It introduces a novel oxygen plasma oxidation method to produce ultrathin GaS$_x$O$_y$ layers on 2D GaS, facilitating low-power electronic memory applications.
Findings
Achieved ~4 nm native gallium oxide on 2D GaS
Demonstrated resistive switching with low energy per operation
Maintained endurance of 350 cycles and retention of 10^4 seconds
Abstract
Oxidation of two-dimensional (2D) layered materials has proven advantageous in creating oxide/2D material heterostructures, opening the door for a new paradigm of low-power electronic devices. Gallium (II) sulfide (-GaS), a hexagonal phase group III monochalcogenide, is a wide bandgap semiconductor with a bandgap exceeding 3 eV in single and few layer form. Its oxide, gallium oxide (GaO), combines large bandgap (4.4-5.3 eV) with high dielectric constant (~10). Despite the technological potential of both materials, controlled oxidation of atomically-thin -GaS remains under-explored. This study focuses into the controlled oxidation of -GaS using oxygen plasma treatment, achieving ultrathin native oxide (GaSO, ~4 nm) and GaSO/GaS heterostructures where the GaS layer beneath remains intact. By integrating such structures between metal electrodes…
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Taxonomy
TopicsGa2O3 and related materials · GaN-based semiconductor devices and materials · ZnO doping and properties
