mm-Wave and sub-THz Chip-to-Package Transitions for Communications Systems

TL;DR

This paper introduces low-loss mm-Wave and sub-THz chip-to-package transitions for communication systems, achieving less than 1 dB loss in two commercial packaging technologies, improving over prior high-loss solutions.

Contribution

It presents a novel design methodology for chip-to-package transitions that significantly reduces loss to below 1 dB in different commercial packaging technologies.

Findings

Transitions achieve <1 dB loss in two technologies

Design methodology validated through experimental results

Impact on high frequency, wide bandwidth communication systems

Abstract

This work presents mm-Wave and sub-THz chip-to-package transitions for communications systems. To date, reported transitions either have high loss, typically 3 to 4 dB, or require high cost packages to support very fine bump pitches and low loss materials. We analyze the impact of transitions on a high frequency, wide bandwidth communication system and present the design of a chip-to-package transition in two different commercial packaging technologies. The proposed transitions achieve <1 dB loss in both technologies, validating the design methodology.