Timing resolution performance of Timepix4 bump-bonded assemblies

TL;DR

This paper evaluates the timing resolution of Timepix4 ASIC bump-bonded to silicon sensors, demonstrating sub-100 ps resolution at single pixel level and 33 ps when using multi-pixel clusters with oversampling.

Contribution

It provides the first detailed measurement of Timepix4's timing performance with a silicon sensor using laser stimulation, highlighting its high temporal resolution capabilities.

Findings

Single pixel timing resolution of 107 ps rms

Multi-pixel cluster resolution of 33 ps rms

Effective oversampling improves timing precision

Abstract

The timing performance of the Timepix4 application-specific integrated circuit (ASIC) bump-bonded to a $100\;\mu\textrm{m}$ thick n-on-p silicon sensor is presented. A picosecond pulsed infrared laser was used to generate electron-hole pairs in the silicon bulk in a repeatable fashion, controlling the amount, position and time of the stimulated charge signal. The timing resolution for a single pixel has been measured to $107\;\textrm{ps}$ r.m.s. for laser-stimulated signals in the silicon sensor bulk. Considering multi-pixel clusters, the measured timing resolution reached $33\;\textrm{ps}$ r.m.s. exploiting oversampling of the timing information over several pixels.