A Hybrid Process for Integration of Organic Electrochemical Transistors for High Uniformity & Reliability

TL;DR

This paper introduces a hybrid fabrication process combining orthogonal photolithography and inkjet printing to enhance the uniformity and reliability of organic electrochemical transistors, addressing challenges in organic electronics manufacturing.

Contribution

It presents a novel hybrid process for organic electrochemical transistors that improves uniformity and reliability by integrating photolithography with inkjet printing.

Findings

Process resolution impacts device uniformity

Hybrid method enables better device scaling

Improved circuit integration capabilities

Abstract

Photolithography is believed to be a complementary technique to large-area printing, allowing for nanometer-scale integration and offering cost-efficiency. For organic electronics though, adapting photolithography is very challenging due to chemical incompatibilities. However, with the help of Alexander Zakhidov, orthogonal resins opened up the prospect of adapting the well-established process of photolithography for organic electronics. Here, we present a hybrid fabrication method for organic electrochemical transistors by combining orthogonal photolithography and inkjet printing, enabling high uniformity and reliability. We demonstrate how the resolution of each process affects the uniformity, and we explore the advantages of this process for device scaling and circuit integration.