Packaged Cryogenic Photon Pair Source Using an Effective Packaging Methodology for Cryogenic Integrated Optics

TL;DR

This paper introduces a versatile cryogenic packaging method for integrated photonics that enables high-performance single photon pair generation at cryogenic temperatures, demonstrated on silicon ring resonators with significantly increased pair rates.

Contribution

The paper presents a widely applicable cryogenic packaging technique compatible with standard photonic chips, facilitating enhanced quantum photonics experiments at low temperatures.

Findings

Achieved 183-fold increase in pair generation rate at 5.9 K compared to room temperature.

Developed a packaging method requiring only common lab equipment and techniques.

Enabled effective operation of integrated photonic circuits at cryogenic temperatures.

Abstract

A new cryogenic packaging methodology that is widely applicable to packaging any integrated photonics circuit for operation at both room temperature and cryogenic temperature is reported. The method requires only equipment and techniques available in any integrated optics lab and works on standard integrated photonic chips. Our methodology is then used to enable the measurement of a single photon pair sourced based on a silicon ring resonator at cryogenic temperatures. When operating at 5.9 K, this source is measured to have a peak pair generation rate 183 times greater then at room temperature in the CL-band.