Local laser-induced solid-phase recrystallization of phosphorus-implanted Si/SiGe heterostructures for contacts below 4.2 K
Malte Neul, Isabelle V. Sprave, Laura K. Diebel, Lukas G. Zinkl,, Florian Fuchs, Yuji Yamamoto, Christian Vedder, Dominique Bougeard, Lars R., Schreiber

TL;DR
This paper introduces a laser-based local annealing technique for creating ohmic contacts in Si/SiGe heterostructures, enabling high-quality contacts at cryogenic temperatures while preserving the delicate layer structure.
Contribution
It presents a novel laser annealing process for ion-implanted contacts in Si/SiGe heterostructures, reducing thermal impact and enabling optimized low-temperature device performance.
Findings
Laser annealing achieves comparable or better contact quality than global annealing.
The process is quickly adaptable using optical inspection calibration.
High electron mobility and low contact resistance are maintained below 4.2 K.
Abstract
Si/SiGe heterostructures are of high interest for high mobility transistor and qubit applications, specifically for operations below 4.2 K. In order to optimize parameters such as charge mobility, built-in strain, electrostatic disorder, charge noise and valley splitting, these heterostructures require Ge concentration profiles close to mono-layer precision. Ohmic contacts to undoped heterostructures are usually facilitated by a global annealing step activating implanted dopants, but compromising the carefully engineered layer stack due to atom diffusion and strain relaxation in the active device region. We demonstrate a local laser-based annealing process for recrystallization of ion-implanted contacts in SiGe, greatly reducing the thermal load on the active device area. To quickly adapt this process to the constantly evolving heterostructures, we deploy a calibration procedure based…
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Taxonomy
TopicsSemiconductor Quantum Structures and Devices · Advancements in Semiconductor Devices and Circuit Design · Force Microscopy Techniques and Applications
