Wafer-scale Computing: Advancements, Challenges, and Future Perspectives

TL;DR

This paper reviews the current state, technological advancements, and challenges of wafer-scale computing, highlighting its potential to overcome hardware limitations in AI development and discussing future research directions.

Contribution

It provides the first comprehensive survey summarizing wafer-scale chips, technologies, and design insights, aiding academia and industry understanding of this emerging field.

Findings

Wafer-scale computing offers high bandwidth and integration density.

Advanced packaging technologies enable larger, more integrated chips.

Significant design and optimization challenges remain for wafer-scale systems.

Abstract

Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand for the computing power of the hardware. As the computing demand for AI continues to grow, the growth of hardware computing power has failed to keep up. This has become a significant factor restricting the development of AI. The augmentation of hardware computing power is mainly propelled by the escalation of transistor density and chip area. However, the former is impeded by the termination of the Moore's Law and Dennard scaling, and the latter is significantly restricted by the challenge of disrupting the legacy fabrication equipment and process. In recent years, advanced packaging technologies that have gradually matured are increasingly used to implement bigger chips that integrate multiple chiplets, while still providing interconnections with chip-level density and bandwidth. Compared to conventional high-performance computing paradigms such as multi-accelerator and datacenter-scale computing, Wafer-scale Computing shows remarkable advantages in communication bandwidth, integration density, and programmability potential. Not surprisingly, disruptive Wafer-scale Computing also brings unprecedented design challenges for hardware architecture, design-system-technology co-optimization, power and cooling systems, and compiler tool chain. At present, there are no comprehensive surveys summarizing the current state and design insights of Wafer-scale Computing. This paper aims to take the first step to help academia and industry review existing wafer-scale chips and essential technologies in a one-stop manner. So that people can conveniently grasp the basic knowledge and key points, understand the achievements and shortcomings of existing research, and contribute to this promising research direction.