Magneto-Thermal Thin Shell Approximation for 3D Finite Element Analysis of No-Insulation Coils

TL;DR

This paper introduces a coupled magneto-thermal thin shell approximation for 3D finite element analysis of no-insulation high-temperature superconducting pancake coils, reducing mesh complexity and computational effort.

Contribution

It develops a novel coupled magneto-thermal thin shell approximation that simplifies modeling of T2TCL in NI HTS coils, improving efficiency and accuracy.

Findings

Significantly reduces solution time.

Decreases manual meshing effort.

Accurately models T2TCL effects.

Abstract

For finite element (FE) analysis of no-insulation (NI) high-temperature superconducting (HTS) pancake coils, the high aspect ratio of the turn-to-turn contact layer (T2TCL) leads to meshing difficulties which result in either poor quality mesh elements resulting in a decrease of the solution accuracy or a high number of degrees of freedom. We proposed to mitigate this issue by collapsing the T2TCL volume into a surface and using a so-called thin shell approximation (TSA). Previously, two TSA have been introduced, one to solve the heat equation and the other for an $\vec{H}-\phi$ magnetodynamic formulation. In this work, we propose to combine the magnetodynamic and thermal TSA to create a coupled magneto-thermal TSA for three-dimensional FE analysis. Particular attention is paid to the detailed derivation of the coupling terms. In the context of NI HTS pancake coils, the TSA represents the electric and thermal contact resistance of the T2TCL. For the HTS coated conductor (CC) itself, an anisotropic homogenization is used which represents its multi-layered structure. In axial and azimuthal direction, it resolves the current sharing between the HTS and other layers of the CC. The coupled TSA formulation is verified against a reference model with volumetric T2TCL. The coupled TSA is shown to significantly reduce the solution time as well as the manual effort required for high-quality meshes of the T2TCL. The implementation is open-source and a reference implementation is made publicly available.