Distinguishing the importance of different charge trapping centers in CaF2-based 2D material MOSFETs

TL;DR

This paper investigates the role of various charge trapping centers in CaF2-based 2D material MOSFETs, highlighting the impact of intrinsic defects and adsorbed oxygen molecules on device reliability and performance.

Contribution

It provides a detailed comparison of defect importance in n-type and p-type devices and emphasizes the significance of oxygen adsorption in device reliability.

Findings

Oxygen molecules at interfaces act as active charge traps.

Intrinsic defects and adsorbed oxygen can alter device polarity.

High vacuum packaging is crucial for improved device performance.

Abstract

Crystalline CaF2 is drawing huge attentions due to its great potential of being the gate dielectric of two-dimensional (2D) material MOSFETs. It is deemed to be much superior than boron nitride and traditional SiO2 because of its larger dielectric constant, wider band gap, and lower defect density. Nevertheless, the CaF2-based MOSFETs fabricated in experiment still present notable reliability issues, and the underlying reason remains unclear. Here we studied the various intrinsic defects and adsorbates in CaF2/MoS2 and CaF2/MoSi2N4 interface systems to reveal the most active charge trapping centers in CaF2-based 2D material MOSFETs. An elaborate Table that comparing the importance of different defects in both n-type and p-type device is provided. Most impressively, the oxygen molecules adsorbed at the interface or surface, which are inevitable in experiments, are as active as the intrinsic defects in channel materials, and they can even change the MoSi2N4 to p-type spontaneously. These results mean that it is necessary to develop high vacuum packaging process as well as preparing high-quality 2D materials for better device performance.