Superefficient microcombs at the wafer level
Marcello Girardi, \'Oskar B. Helgason, Carmen H. L\'opez Ortega,, Israel Rebolledo-Salgado, Victor Torres-Company

TL;DR
This paper presents a wafer-scale silicon nitride platform enabling high-efficiency, stable soliton microcombs with over 50% conversion efficiency and 100 lines, advancing large-scale photonic integration for diverse applications.
Contribution
It demonstrates wafer-level fabrication of soliton microcombs with high yield, spectral stability, and power efficiency, surpassing previous die-level solutions.
Findings
Achieved >50% average conversion efficiency in microcombs.
Produced 100 lines at 100 GHz repetition rate.
Enabled new sensing applications through wafer-level redundancy.
Abstract
Photonic integrated circuits utilize planar waveguides to process light on a chip, encompassing functions like generation, routing, modulation, and detection. Similar to the advancements in the electronics industry, photonics research is steadily transferring an expanding repertoire of functionalities onto integrated platforms. The combination of best-in-class materials at the wafer-level increases versatility and performance, suitable for large-scale markets, such as datacentre interconnects, lidar for autonomous driving or consumer health. These applications require mature integration platforms to sustain the production of millions of devices per year and provide efficient solutions in terms of power consumption and wavelength multiplicity for scalability. Chip-scale frequency combs offer massive wavelength parallelization, holding a transformative potential in photonic system…
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Taxonomy
TopicsAdvanced Fiber Laser Technologies · Photonic and Optical Devices · Advanced Fiber Optic Sensors
