Predicting Coupled Electron and Phonon Transport Using Steepest-Entropy-Ascent Quantum Thermodynamics
J. A. Worden, M. R. von Spakovsky, C. Hin

TL;DR
This paper introduces a novel application of the steepest-entropy-ascent quantum thermodynamics (SEAQT) framework to predict coupled electron and phonon transport in thermoelectric materials, offering accurate results with reduced computational effort.
Contribution
It demonstrates how SEAQT can effectively model coupled electron-phonon transport properties using ab initio data, significantly lowering computational costs compared to traditional methods.
Findings
SEAQT accurately predicts transport properties of Si, doped Si, and Bi2Te3.
The method captures e-DOS and p-DOS coupling effects.
Results agree well with experimental data.
Abstract
The principal paradigm for determining the thermoelectric properties of materials is based on the Boltzmann transport equations (BTEs) or Landauer equivalent. These equations depend on the electron and phonon density of states (e-DOS and p-DOS) derived from ab initio calculations performed using density functional theory and density functional perturbation theory. Recent computational advances have enabled consideration of phonon-phonon and electron-phonon interactions in these calculations. Leveraging these DOS, the single species BTE or Landauer equivalent can ascertain key thermoelectric properties but overlooks the intrinsic coupling between the e-DOS and p-DOS. To account for this, the multispecies BTE paradigm has, despite its substantial computational burden, been utilized, yielding excellent results in agreement with experiment. To alleviate this computational burden, the…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsAdvanced Thermodynamics and Statistical Mechanics · Advanced Thermoelectric Materials and Devices · Thermal properties of materials
