Temperature dependent magnetoelectric response of lead-free Na$_{0.4}$K$_{0.1}$Bi$_{0.5}$TiO$_3$-NiFe$_2$O$_4$ laminated composites

TL;DR

This paper explores how the magnetoelectric response of lead-free NKBT-NFO laminated composites varies with temperature, revealing their potential and limitations for temperature-sensitive sensor applications.

Contribution

It provides the first detailed analysis of the temperature-dependent magnetoelectric behavior of lead-free NKBT-NFO laminated composites, highlighting their temperature stability limits.

Findings

ME response decreases with temperature above 110°C

Magnetostriction reduces by approximately 33% up to 125°C

Maximum ME responses are 33 mV/cm.Oe (bilayer) and 80 mV/cm.Oe (trilayer) at room temperature

Abstract

This study investigates the temperature-dependent quasi-static magnetoelectric (ME) response of electrically poled lead-free Na$_{0.4}$K$_{0.1}$Bi$_{0.5}$TiO$_3$-NiFe$_2$O$_4$ (NKBT-NFO) laminated composites. The aim is to understand the temperature stability of ME-based sensors and devices. The relaxor ferroelectric nature of NKBT is confirmed through impedance and polarization-electric (PE) hysteresis loop studies, with a depolarization temperature (Td) of approximately 110$^\circ$C. Heating causes a decrease and disappearance of planar electromechanical coupling, charge coefficient, and remnant polarization above Td. The temperature rise also leads to a reduction in magnetostriction and magnetostriction coefficient of NFO by approximately 33% and 25%, respectively, up to approximately 125$^\circ$C. At room temperature, the bilayer and trilayer configurations exhibit maximum ME responses of approximately 33 mV/cm.Oe and 80 mV/cm.Oe, respectively, under low magnetic field conditions (300-450 Oe). The ME response of NKBT/NFO is highly sensitive to temperature, decreasing with heating in accordance with the individual temperature-dependent properties of NKBT and NFO. This study demonstrates a temperature window for the effective utilization of NKBT-NFO-based laminated composite ME devices.