Probing single electrons across 300 mm spin qubit wafers
Samuel Neyens, Otto K. Zietz, Thomas F. Watson, Florian Luthi, Aditi, Nethwewala, Hubert C. George, Eric Henry, Mohammad Islam, Andrew J. Wagner,, Felix Borjans, Elliot J. Connors, J. Corrigan, Matthew J. Curry, Daniel, Keith, Roza Kotlyar, Lester F. Lampert, Mateusz T. Madzik

TL;DR
This paper demonstrates a high-throughput cryogenic testing process for 300 mm silicon spin qubit wafers, enabling rapid device characterization, process optimization, and analysis of single-electron behavior at scale.
Contribution
It introduces a novel cryogenic wafer probing method for large-scale spin qubit testing, improving yield and reducing process variation in quantum device fabrication.
Findings
High-yield fabrication process with low disorder levels
Automated measurement of single-electron operating points
Low variation in electron transition voltages across wafers
Abstract
Building a fault-tolerant quantum computer will require vast numbers of physical qubits. For qubit technologies based on solid state electronic devices, integrating millions of qubits in a single processor will require device fabrication to reach a scale comparable to that of the modern CMOS industry. Equally importantly, the scale of cryogenic device testing must keep pace to enable efficient device screening and to improve statistical metrics like qubit yield and voltage variation. Spin qubits based on electrons in Si have shown impressive control fidelities but have historically been challenged by yield and process variation. Here we present a testing process using a cryogenic 300 mm wafer prober to collect high-volume data on the performance of hundreds of industry-manufactured spin qubit devices at 1.6 K. This testing method provides fast feedback to enable optimization of the…
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Taxonomy
TopicsQuantum and electron transport phenomena · Surface and Thin Film Phenomena · Advancements in Semiconductor Devices and Circuit Design
