Recent advances in metallographic polishing for SRF application
O. Hryhorenko, C. Z. Antoine, T. Proslier, F. Eozenou, T., Dohmae, S. Keckert, O. Kugeler, J. Knobloch, D.Longuevergne
TL;DR
This paper reviews recent developments in metallographic polishing techniques for niobium and copper substrates aimed at improving SRF cavity performance, safety, and cost-effectiveness.
Contribution
It provides an overview of innovative surface processing methods developed collaboratively for SRF applications, focusing on safety, ecological impact, and cost reduction.
Findings
Enhanced surface quality for SRF cavities
Reduced safety and ecological risks
Potential cost savings in fabrication
Abstract
This paper is an overview of the metallographic polishing R&D program covering Niobium and Copper substrates treatment for thin film coating as an alternative fabrication pathway for 1.3 GHz elliptical cavities. The presented research is the result of a collaborative effort between IJCLab, CEA/Irfu, HZB, and KEK in order to develop innovative surface processing and cavity fabrication protocols capable of meeting stringent requirements for SRF surfaces, including the reduction of safety risks and ecological footprint, enhancing reliability, improving the surface roughness, and potentially allowing cost reduction. The research findings will be disclosed.
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