Indium-Bond-And-Stop-Etch (IBASE) Technique for Dual-side Processing of Thin High-mobility GaAs/AlGaAs Epitaxial Layers
Changyun Yoo, Kenneth W. West, Loren N. Pfeiffer, Chris A. Curwen,, Jonathan H. Kawamura, Boris S. Karasik, and Mark S. Sherwin

TL;DR
This paper introduces the IBASE technique enabling dual-side processing of ultra-thin GaAs/AlGaAs layers, preserving high mobility and charge density, and demonstrating precise control of intersubband absorption for THz detectors.
Contribution
The paper presents a novel flip-chip IBASE method for dual-side processing of thin high-mobility GaAs/AlGaAs layers with high alignment accuracy and minimal mobility loss.
Findings
High-mobility GaAs/AlGaAs layers retain >95% charge density
Dual-gate structures enable linear charge density control
Tuning of intersubband absorption near 3.44 THz demonstrated
Abstract
We present a reliable flip-chip technique for dual-side processing of thin (<1 micron) high-mobility GaAs/AlGaAs epitaxial layers. The technique allows the fabrication of small (micron-scale with standard UV photolithography) patterned back gates and dual-gate structures on the thin GaAs/AlGaAs films with good alignment accuracy using only frontside alignment. The technique preserves the high-mobility (>10^6 cm^2 /V-s at 2 K) and most (>95%) of the charge density of the 2-dimensional electron gas (2DEG) systems, and allows linear control of the charge density with small (< 1 V) electrostatic gate bias. Our technique is motivated by a novel THz quantum-well detector based on intersubband transitions in a single, wide GaAs/AlGaAs quantum well, in which a symmetric, well-aligned dual-gate structure (with a typical gate dimension of ~5 micron by 5 micron) is required for accurate and…
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Taxonomy
TopicsSemiconductor Quantum Structures and Devices · Semiconductor materials and devices · GaN-based semiconductor devices and materials
