Van der Waals device integration beyond the limits of van der Waals forces via adhesive matrix transfer
Peter F. Satterthwaite, Weikun Zhu, Patricia Jastrzebska-Perfect,, Melbourne Tang, Hongze Gao, Hikari Kitadai, Ang-Yu Lu, Qishuo Tan, Shin-Yi, Tang, Yu-Lun Chueh, Chia-Nung Kuo, Chin Shan Lue, Jing Kong, Xi Ling, Farnaz, Niroui

TL;DR
This paper introduces a novel adhesive matrix transfer method enabling direct, solvent-free integration of diverse 2D materials with dielectrics and device fabrication, overcoming limitations of traditional van der Waals interfaces.
Contribution
The authors present a single-step transfer technique that decouples transfer forces from van der Waals forces, allowing for scalable, clean, and versatile integration of 2D materials into electronic devices.
Findings
Enabled direct integration of various 2D materials with dielectrics.
Achieved scalable, aligned heterostructure formation.
Demonstrated flexible transistors with pristine interfaces.
Abstract
Pristine van der Waals (vdW) interfaces between two-dimensional (2D) and other materials are core to emerging optical and electronic devices. Their direct fabrication is, however, challenged as the vdW forces are weak and cannot be tuned to accommodate integration of arbitrary layers without solvents, sacrificial-layers or high-temperatures, steps that can introduce damage. To address these limitations, we introduce a single-step 2D material-to-device integration approach in which forces promoting transfer are decoupled from the vdW forces at the interface of interest. We use this adhesive matrix transfer to demonstrate conventionally-forbidden direct integration of diverse 2D materials (MoS2, WSe2, PtS2, GaS) with dielectrics (SiO2, Al2O3), and scalable, aligned heterostructure formation, both foundational to device development. We then demonstrate a single-step integration of…
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Taxonomy
Topics2D Materials and Applications · Advanced Sensor and Energy Harvesting Materials · Graphene research and applications
