Measuring spatially-resolved potential drops at semiconductor hetero-interfaces using 4D-STEM

TL;DR

This paper demonstrates a method using 4D-STEM to measure and analyze the spatially-resolved electric potential drops at semiconductor hetero-interfaces, enabling more precise characterization of device-relevant electric fields.

Contribution

The study introduces a quantitative 4D-STEM approach for measuring built-in potentials at hetero-interfaces, validated with simulations and optimized measurement techniques.

Findings

Potential drop at the hetero-interface is about 0.1 V.

Precession, energy filtering, and non-zone-axis alignment improve measurement quality.

Method accurately measures potentials in real device structures.

Abstract

Characterizing long-range electric fields and built-in potentials in functional materials at nano- to micrometer scales is of supreme importance for optimizing devices. E.g., the functionality of semiconductor heterostructures or battery materials is determined by the electric fields established at interfaces which can also vary spatially. In this study, we propose momentum-resolved four-dimensional scanning transmission electron microscopy (4D-STEM) for the quantification of these potentials and show the optimization steps required to reach quantitative agreement with simulations for the GaAs / AlAs hetero-junction model system. Using STEM the differences in the mean inner potentials (DELTA MIP) of two materials forming an interface and resulting dynamic diffraction effects have to be considered. We show that the measurement quality is significantly improved by precession, energy filtering and a non-zone-axis alignment of the specimen. Complementary simulations yielding a DELTA MIP of 1.3 V confirm that the potential drop due to charge transfer at the intrinsic interface is about 0.1 V, in agreement with experimental and theoretical values found in literture. These results show the feasibility of accurately measuring built-in potentials across hetero-interfaces of real device structures and its promising application for more complex interfaces of other polycrystalline materials on the nanometer scale.