Atomistic modeling of metal-nonmetal interphase boundary diffusion

TL;DR

This study uses atomistic simulations to explore the structure, stability, and diffusion mechanisms at Al-Si metal-ceramic interfaces, revealing slow diffusion rates and atomic rearrangements similar to metallic grain boundaries.

Contribution

It provides new insights into the atomic structure and diffusion processes at metal-nonmetal interfaces, highlighting mechanisms like interface-induced recrystallization and disconnection effects.

Findings

Stable orientation relationships align with experimental observations.

Interphase boundary diffusion is slower than grain boundary diffusion.

Atomic diffusion involves collective atomic rearrangements.

Abstract

Atomistic computer simulations are applied to investigate the atomic structure, thermal stability, and diffusion processes in Al-Si interphase boundaries as a prototype of metal-ceramic interfaces in composite materials. Some of the most stable orientation relationships between the phases found in this work were previously observed in epitaxy experiments. A non-equilibrium interface can transform to a more stable state by a mechanism that we call interface-induced recrystallization. Diffusion of both Al and Si atoms in stable Al-Si interfaces is surprisingly slow compared with diffusion of both elements in Al grain boundaries but can be accelerated in the presence of interface disconnections. A qualitative explanation of the sluggish interphase boundary diffusion is proposed. Atomic mechanisms of interphase boundary diffusion are similar to those in metallic grain boundaries and are dominated by correlated atomic rearrangements in the form of strings and rings of collectively moving atoms.