Timing performances of front-end electronics with 3D-trench silicon sensors

TL;DR

This paper evaluates the timing performance of front-end electronics, specifically Trans-Impedance Amplifiers, when used with 3D-trench silicon sensors, to optimize high-resolution timing in high-energy physics detectors.

Contribution

It provides an analysis of how different configurations of front-end circuits affect the timing resolution of 3D-trench silicon sensors.

Findings

Optimal circuit configurations improve timing resolution.

Certain modes of operation are preferred for sensor read-out.

Performance limits are characterized for the studied electronics.

Abstract

Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information in tracking, due to the expected levels of track densities in the foreseen experimental conditions. A promising solution to gain high-resolution performance at the sensor level is given by so-called 3D silicon sensors. The excellent intrinsic time resolution of a special case of 3D sensors, the trench type, is limited by residual non-uniformities in the duration of the induced currents. The intrinsic contribution of the sensor to the total time resolution of the system, when the detector is coupled to a front-end electronics, depends on the characteristics of the electronics itself and can be minimized with a proper design. This paper aims to analyze the possible performance in the timing of a typically-used front-end circuit, the Trans-Impedance Amplifier, considering different possible configurations. Evidence of the preferred modes of operation in sensor read-out for timing measurement will be given.