Resistive Switching and Current Conduction Mechanisms in Hexagonal Boron Nitride Threshold Memristors with Nickel Electrodes
Lukas V\"olkel, Dennis Braun, Melkamu Belete, Satender Kataria,, Thorsten Wahlbrink, Ke Ran, Kevin Kistermann, Joachim Mayer, Stephan Menzel,, Alwin Daus, Max C. Lemme

TL;DR
This study investigates resistive switching mechanisms in h-BN memristors with nickel electrodes, revealing filament formation along boron defects as the key process, supported by electrical and TEM analyses, with promising performance metrics.
Contribution
It provides direct electrical evidence and TEM validation for filament-based switching mechanisms in h-BN memristors, advancing understanding of 2D material-based resistive devices.
Findings
Filament formation and retraction along boron defects drive switching.
Memristors show a large On/Off ratio of 10^7.
Device exhibits low variability of 5% cycle-to-cycle.
Abstract
The two-dimensional (2D) insulating material hexagonal boron nitride (h BN) has attracted much attention as the active medium in memristive devices due to its favorable physical properties, among others, a wide bandgap that enables a large switching window. Metal filament formation is frequently suggested for h-BN devices as the resistive switching (RS) mechanism, usually supported by highly specialized methods like conductive atomic force microscopy (C-AFM) or transmission electron microscopy (TEM). Here, we investigate the switching of multilayer hexagonal boron nitride (h-BN) threshold memristors with two nickel (Ni) electrodes through their current conduction mechanisms. Both the high and the low resistance states are analyzed through temperature-dependent current-voltage measurements. We propose the formation and retraction of nickel filaments along boron defects in the h-BN film…
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Taxonomy
TopicsAdvanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Graphene research and applications
