Illuminating trap density trends in amorphous oxide semiconductors with ultrabroadband photoconduction
George W. Mattson (1), Kyle T. Vogt (1), John F. Wager (2), Matt W., Graham (1) ((1) Department of Physics, Oregon State University, Corvallis, OR, (2) School of EECS, Oregon State University, Corvallis, OR)

TL;DR
This study uses ultrabroadband photoconduction to analyze defect density trends in amorphous oxide semiconductors, revealing how fabrication and processing conditions influence trap states and device performance.
Contribution
It introduces UBPC as a tool to identify and confirm defect states in amorphous oxide semiconductors, linking processing methods to defect density variations and electrical properties.
Findings
Identification of seven oxygen-deep donor vacancy peaks.
Deep acceptor peak at 2.2 eV linked to zinc vacancies.
Processing damage increases trap densities and affects electrical performance.
Abstract
Under varying growth and device processing conditions, ultrabroadband photoconduction (UBPC) reveals strongly evolving trends in the defect density of states (DoS) for amorphous oxide semiconductor thin-film transistors (TFTs). Spanning the wide bandgap of amorphous InGaZnO (a-IGZO), UBPC identifies seven oxygen-deep donor vacancy peaks that are independently confirmed by energetically matching to photoluminescence emission peaks. The sub-gap DoS from 15 different types of a-IGZO TFTs all yield similar DoS, except only back-channel etch TFTs can have a deep acceptor peak seen at 2.2 eV below the conduction band mobility edge. This deep acceptor is likely a zinc vacancy, evidenced by trap density which becomes 5-6x larger when TFT wet-etch methods are employed. Certain DoS peaks are strongly enhanced for TFTs with active channel processing damage caused by plasma exposure. While Ar…
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Taxonomy
TopicsThin-Film Transistor Technologies · Surface Roughness and Optical Measurements · Silicon and Solar Cell Technologies
