Electrochemical Polishing of Chemical Vapor Deposited Niobium Thin Films
Zeming Sun, Mingqi Ge, James T. Maniscalco, Victor Arrieta, Shawn R., McNeal, Matthias U. Liepe

TL;DR
This study investigates how electrochemical polishing improves the surface quality of CVD-grown niobium thin films, crucial for superconducting applications, revealing mechanisms and dependencies that enhance film performance.
Contribution
It provides new insights into the polishing mechanisms and crystal orientation effects on electrochemical polishing of CVD niobium films, aiding in surface optimization for SRF devices.
Findings
EP significantly reduces surface roughness and pyramidal features.
Polishing effectiveness depends on crystal orientation.
EP influences surface morphology differently than BCP.
Abstract
Combining chemical vapor deposition (CVD) with electrochemical polish (EP) operations is a promising route to producing performance-capable superconducting films for use in the fabrication of cost-effective components for superconducting radiofrequency (SRF) particle accelerators and superconducting quantum computers. The post-deposition EP process enables a critically necessary reduction in surface roughness of niobium thin films to promote optimal superconducting surface conditions. In this work, surface morphology, roughness, and crystal orientation of the CVD-grown and EP-polished niobium films were investigated. The grain growth and polishing mechanisms were analyzed. The CVD films were found to comprise steps, kinks, and pyramidal features, resulting in undesirable large peak-to-valley distances. The electrochemical polish was demonstrated to significantly diminish the height of…
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Taxonomy
TopicsMetal and Thin Film Mechanics · Copper Interconnects and Reliability · Plasma Diagnostics and Applications
