Rubidium Focused Ion Beam Induced Platinum Deposition
Yang Li (1), Sheng Xu (1), Meltem Sezen (2), Feray Bakan Misirlioglu, (2), Edgar Vredenbregt (1) ((1) Department of Applied Physics, Eindhoven, University of Technology, (2) Sabanci University Nanotechnology Research and, Application Center)

TL;DR
This study compares rubidium and gallium focused ion beam induced platinum deposition, revealing similar deposition rates but differences in composition and resistivity, with potential implications for material properties.
Contribution
It is the first detailed characterization of Rb$^+$ FIBID of platinum, highlighting differences from Ga$^+$ FIBID in composition and electrical resistivity.
Findings
Rb$^+$ FIBID-Pt has similar deposition rates to Ga$^+$ FIBID-Pt.
Rb$^+$ FIBID-Pt contains less primary ion contamination.
Resistivity of Rb$^+$ FIBID-Pt is higher than that of Ga$^+$ FIBID-Pt.
Abstract
This work presents characterization of focused ion beam induced deposition (FIBID) of platinum using both rubidium and gallium ions. Under similar beam energies, 8.5 keV for Rb and 8.0 keV for Ga, and beam current near 10 pA, the two ion species deposited Pt films at similar rates. Energy-dispersive x-ray spectroscopy shows that the Rb FIBID-Pt consists of similar Pt contents with much lower primary ion contents (5% Rb and 27% Ga) than the Ga FIBID-Pt. The deposited material was also measured to have a resistivity of for the Rb FIBID-Pt and for the Ga FIBID-Pt.
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Taxonomy
TopicsIon-surface interactions and analysis · Electron and X-Ray Spectroscopy Techniques · Integrated Circuits and Semiconductor Failure Analysis
