Thermal diode assisted by geometry under cycling temperature

TL;DR

This paper models heat transport in a geometrically asymmetric square plate with a hole under cycling temperature, demonstrating its potential as a thermal diode for protecting electronics in aggressive thermal environments.

Contribution

It introduces a novel geometric configuration that enables heat rectification under oscillating temperatures, advancing thermal management technology.

Findings

Heat current rectification depends on frequency and geometry.

The system functions effectively as a thermal diode.

Potential application in thermal protection of electronics.

Abstract

Technological progress in electronics usually requires their use in increasingly aggressive environments, such as rapid thermal cycling and high power density. Thermal diodes appear as excellent candidates to thermally protect critical electronic components and ensure durability and reliability. We model the heat transport across a square plate with a hole subjected to an oscillating external temperature, such spatial and temporal symmetries are broken. We find rectification of the heat current that strongly depends on the frequency and the geometry of the hole. This system behaves as a thermal diode that could be used as part of a thermal architecture to dissipate heat under cycling temperature conditions.