Emergence of large spin-charge interconversion at an oxidized Cu/W interface
Inge Groen, Van Tuong Pham, Stefan Ili\'c, Won Young Choi, Andrey, Chuvilin, Edurne Sagasta, Diogo C. Vaz, Isabel C. Arango, Nerea Ontoso, F., Sebastian Bergeret, Luis E. Hueso, Ilya V. Tokatly, F\`elix Casanova

TL;DR
This study reveals a highly efficient spin-charge interconversion at an oxidized Cu/WO$_x$ interface, which could significantly enhance the performance of spin-orbitronic devices like MESO logic.
Contribution
It uncovers the origin and quantifies the efficiency of SCI at the Cu/WO$_x$ interface, demonstrating its superior performance compared to other interfaces.
Findings
SCI occurs at the Cu/WO$_x$ interface with high efficiency.
The interfacial spin-loss conductance is temperature-independent.
The inverse Edelstein length is significantly larger than in other metal interfaces.
Abstract
Spin-orbitronic devices can integrate memory and logic by exploiting spin-charge interconversion (SCI), which is optimized by design and materials selection. In these devices, such as the magnetoelectric spin-orbit (MESO) logic, interfaces are crucial elements as they can prohibit or promote spin flow in a device as well as possess spin-orbit coupling resulting in interfacial SCI. Here, we study the origin of SCI in a Py/Cu/W lateral spin valve and quantify its efficiency. An exhaustive characterization of the interface between Cu and W electrodes uncovers the presence of an oxidized layer (WO). We determine that the SCI occurs at the Cu/WO interface with a temperature-independent interfacial spin-loss conductance of 20 10 and an interfacial spin-charge conductivity 1610 at 10 K (830…
Peer Reviews
No public reviews on file for this paper yet. If you reviewed it on a platform where reviews are public (OpenReview, ICLR, NeurIPS, ICML), you can paste yours below so the community can read it here.
Videos
No videos yet. Explain this paper in a talk, walkthrough, or lecture? Add one.
Taxonomy
TopicsMagnetic properties of thin films · Semiconductor materials and devices · Copper Interconnects and Reliability
