A route for the top-down fabrication of ordered ultrathin GaN nanowires
Miriam Oliva, Vladimir Kaganer, Maximilian Pudelski, Sebastian, Meister, Abbes Tahraoui, Lutz Geelhaar, Oliver Brandt, Thomas Auzelle

TL;DR
This paper presents a straightforward top-down method to fabricate highly ordered, ultrathin GaN nanowires with high aspect ratios and diameters below 20 nm, using lithography, etching, and digital etching techniques.
Contribution
The authors introduce a novel, efficient fabrication route for GaN nanowires that achieves diameters down to 5 nm and high uniformity, with potential for regrowth and application to other nanostructures.
Findings
Achieved GaN nanowires with diameters below 20 nm and aspect ratios over 10.
Demonstrated a digital etching process to reduce NW diameter to 5 nm.
Identified mechanical instability and buckling behavior at small diameters, mitigated by critical point drying.
Abstract
Ultrathin GaN nanowires (NWs) are attractive to maximize surface effects and as building block in high-frequency transistors. Here, we introduce a facile route for the top-down fabrication of ordered arrays of GaN NWs with aspect ratios exceeding and diameters below nm. Highly uniform thin GaN NWs are first obtained by using electron beam lithography to pattern a Ni/SiN hard mask, followed by dry etching and wet etching in hot KOH. The SiN is found to work as an etch stop during wet etching in hot KOH. Arrays with NW diameters down to nm can be achieved with a yield exceeding . Further reduction of the NW diameter down to nm is obtained by applying digital etching which consists in plasma oxidation followed by wet etching in hot KOH. The NW radial etching depth is tuned by varying the RF power during plasma oxidation. NW breaking or…
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Taxonomy
TopicsGaN-based semiconductor devices and materials · Acoustic Wave Resonator Technologies · Plasma Diagnostics and Applications
