Stimulated Laser Cooling Using Microfabrication

TL;DR

This paper demonstrates on-chip stimulated laser cooling of rubidium atomic beams using microfabricated silicon components, achieving significant power reduction and compactness, enabling future integrated atomic devices.

Contribution

It introduces a novel on-chip laser cooling method utilizing microfabrication, reducing power requirements and size compared to traditional free-space setups.

Findings

Achieved laser cooling with only 8 mW power.

Reduced transverse velocity spread below 1 m/s.

Demonstrated a compact, chip-scale cooling apparatus.

Abstract

We have achieved stimulated laser cooling of thermal rubidium atomic beams on a silicon chip. Following pre-collimation via a silicon microchannel array, we perform beam brightening via a blue-detuned optical molasses. Owing to the small size of the chip elements, we require only 8 mW, or nine times lower power than earlier free-space experiments on cesium [Aspect et al., Phys. Rev. Lett. 57, 1688 (1986)]. Silicon micromirrors are fabricated and hand-assembled to precisely overlap a strong elliptical standing wave with a sheet-shaped atomic density distribution, with dimensions chosen precisely to match these. We reduce the transverse velocity spread to below 1 m/s within a total travel distance of 4.5 mm on a silicon substrate. We use Doppler-sensitive two-photon Raman spectroscopy to characterize the cooling. In contrast to time-of-flight methods utilized previously, this approach requires a much shorter apparatus to achieve similar resolution. This hybrid of passive and active collimation paves the way toward the construction of full-fledged atomic instruments, such as atomic beam clocks and gyroscopes, entirely on-chip through batch-fabricated processes.