Non-destructive X-ray imaging of patterned delta-layer devices in silicon
Nicol\`o D'Anna, Dario Ferreira Sanchez, Guy Matmon, Jamie Bragg,, Procopios C. Constantinou, Taylor J.Z. Stock, Sarah Fearn, Steven R., Schofield, Neil J. Curson, Marek Bartkowiak, Y. Soh, Daniel Grolimund, Simon, Gerber, Gabriel Aeppli

TL;DR
This paper demonstrates a non-destructive X-ray fluorescence method to image arsenic dopants in silicon with atomic specificity and sub-micron resolution, preserving electronic properties and enabling future atomic-scale imaging.
Contribution
The study introduces a novel X-ray fluorescence technique for non-destructive, element-specific imaging of dopants in silicon, achieving high spatial resolution without damaging the device.
Findings
X-ray fluorescence accurately measures arsenic dopant densities.
Device properties remain unchanged after high X-ray exposure.
Potential for 5 nm resolution imaging with advanced sources.
Abstract
The progress of miniaturisation in integrated electronics has led to atomic and nanometre-sized dopant devices in silicon. Such structures can be fabricated routinely by hydrogen resist lithography, using various dopants such as phosphorous and arsenic. However, the ability to non-destructively obtain atomic-species-specific images of the final structure, which would be an indispensable tool for building more complex nano-scale devices, such as quantum co-processors, remains an unresolved challenge. Here we exploit X-ray fluorescence to create an element-specific image of As dopants in silicon, with dopant densities in absolute units and a resolution limited by the beam focal size (here m), without affecting the device's low temperature electronic properties. The As densities provided by the X-ray data are compared to those derived from Hall effect measurements as well as the…
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Taxonomy
TopicsElectron and X-Ray Spectroscopy Techniques · Thin-Film Transistor Technologies · Silicon and Solar Cell Technologies
