Robust incorporation in multi-donor patches created using atomic-precision advanced manufacturing
Quinn Campbell, Justine C. Koepke, Jeffrey A. Ivie, Andrew M. Mounce,, Daniel R. Ward, Malcolm S. Carroll, Shashank Misra, Andrew D. Baczewski, Ezra, Bussmann

TL;DR
This study models and experimentally validates the robustness of atomic-precision manufacturing for multi-donor silicon patches, showing high incorporation probability despite lithographic variations and stochastic reaction kinetics.
Contribution
It introduces an augmented kinetic model accounting for reaction barriers across dimer rows and demonstrates the robustness of donor incorporation in larger lithographic windows.
Findings
High incorporation probability (>99%) in 2x3 silicon dimer windows.
Incorporation fraction saturates to δ-layer like coverage as window size increases.
Lithographic roughness has negligible impact on incorporation statistics.
Abstract
Atomic-precision advanced manufacturing enables the placement of dopant atoms within 1 lattice site in crystalline Si. However, it has recently been shown that reaction kinetics can introduce uncertainty in whether a single donor will incorporate at all in a minimal 3-dimer lithographic window. In this work, we explore the combined impact of lithographic variation and stochastic kinetics on P incorporation as the size of such a window is increased. We augment a kinetic model for PH dissociation leading to P incorporation on Si(100)-21 to include barriers for reactions across distinct dimer rows. Using this model, we demonstrate that even for a window consisting of 23 silicon dimers, the probability that at least one donor incorporates is nearly unity. We also examine the impact of size of the lithographic window, finding that the incorporation fraction saturates…
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Taxonomy
TopicsSemiconductor materials and devices · Advancements in Semiconductor Devices and Circuit Design · Electron and X-Ray Spectroscopy Techniques
