Boosting thermal conductivity by surface plasmon polaritons propagating along a thin Ti film
Dong-min Kim, Sinwoo Choi, Jungwan Cho, Mikyung Lim, and Bong Jae Lee

TL;DR
This paper experimentally demonstrates that surface plasmon polaritons (SPPs) propagating along a thin Ti film can significantly enhance in-plane thermal conductivity, offering a new method for heat dissipation in microelectronics.
Contribution
It provides the first experimental validation of boosted thermal conduction via SPPs along a thin metal film, with quantification of the conductivity enhancement.
Findings
SPPs can propagate over centimeter distances on a thin Ti film.
A 100-nm-thick Ti film shows approximately 35% higher in-plane thermal conductivity than bulk Ti.
SPPs can be employed for effective heat dissipation in microelectronic devices.
Abstract
We experimentally demonstrate a boosted in-plane thermal conduction by surface plasmon polaritons (SPPs) propagating along a thin Ti film on a glass substrate. Owing to a lossy nature of metal, SPPs can propagate over centimeter-scale distance even with a supported metal film, and resulting ballistic heat conduction can be quantitatively validated. Further, for a 100-nm-thick Ti film on glass substrate, a significant enhancement of in-plane thermal conductivity compared to bulk value () is experimentally shown. This study will provide a new avenue to employ SPPs for heat dissipation along a supported thin film, which can be readily applied to mitigate hot-spot issues in microelectronics.
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Taxonomy
TopicsThermal Radiation and Cooling Technologies · Photonic Crystals and Applications · Thermal properties of materials
